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Searchign results: MR18R326GAG0

MR18R326GAG0 datasheet


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ChipManuals is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 0 - 21
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Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
Datasheet MR18R326GAG0(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
269 Kb
2.
Datasheet MR18R16224DF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
3.
Datasheet MR18R16228DF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
4.
Datasheet MR18R1622AF0-CK8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
5.
Datasheet MR18R1622AF0-CM8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
6.
Datasheet MR18R1622DF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
7.
Datasheet MR18R1622GDF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
8.
Datasheet MR18R16248EG0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
9.
Datasheet MR18R1624AF0-CK8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
10.
Datasheet MR18R1624AF0-CM8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
11.
Datasheet MR18R1624AF1-CN9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
12.
Datasheet MR18R1624AF1-CT9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
13.
Datasheet MR18R1624EG0-CK8Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
14.
Datasheet MR18R1624EG0-CM8Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
15.
Datasheet MR18R1624EG0-CT9Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
16.
Datasheet MR18R1624GEG0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
17.
Datasheet MR18R1628AF0-CK8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
18.
Datasheet MR18R1628AF0-CM8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
19.
Datasheet MR18R1628AF1-CN9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
20.
Datasheet MR18R1628AF1-CT9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
21.
Datasheet MR18R1628EG0-CK8Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb

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