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MR18R1624AF0-CM8 Datasheet

 Datasheet for
Description:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Manufacturer:Samsung semiconductor
Temp. range:Min: - | Max: -
Package:Not available...
Pins:Not available...
Link: MR18R1624AF0-CM8.PDF (431 Kb)


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MR18R1624AF0-CM8.PDF

MR18R1624AF0-CM8 datasheet: (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V MR18R1624AF0-CM8

Datasheet


RELEVANT RESULTS FOR MR18R1624AF0-CM8 DATASHEET

#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
Datasheet MR18R16224DF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
2.
Datasheet MR18R16228DF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
3.
Datasheet MR18R1622AF0-CK8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
4.
Datasheet MR18R1622AF0-CM8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
5.
Datasheet MR18R1622DF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
6.
Datasheet MR18R1622GDF0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
7.
Datasheet MR18R16248EG0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
8.
Datasheet MR18R1624AF0-CK8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
9.
Datasheet MR18R1624AF0-CM8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
10.
Datasheet MR18R1624AF1-CN9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
11.
Datasheet MR18R1624AF1-CT9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
12.
Datasheet MR18R1624EG0-CK8Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
13.
Datasheet MR18R1624EG0-CM8Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
14.
Datasheet MR18R1624EG0-CT9Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
15.
Datasheet MR18R1624GEG0Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb
16.
Datasheet MR18R1628AF0-CK8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
17.
Datasheet MR18R1628AF0-CM8(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
18.
Datasheet MR18R1628AF1-CN9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
19.
Datasheet MR18R1628AF1-CT9(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor
SAMSUNG
-
-
-
431 Kb
20.
Datasheet MR18R1628EG0-CK8Key Timing Parameters
Samsung semiconductor
SAMSUNG
-
-
-
454 Kb

 
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