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MF1ICS5005V1D Datasheet

 Datasheet for
Description:Standard Card IC Specification “bumped sawn wafer on UV-tape”
Manufacturer:NXP Semiconductors
Temp. range:Min: - | Max: -
Package:Not available...
Pins:Not available...
Link: MF1ICS5005V1D.PDF (38 Kb)


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MF1ICS5005V1D.PDF

MF1ICS5005V1D datasheet: Standard Card IC Specification “bumped sawn wafer on UV-tape” MF1ICS5005V1D

Datasheet


RELEVANT RESULTS FOR MF1ICS5005V1D DATASHEET

#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
Datasheet MF1ICS2005Sawn bumped 120lm wafer addendum
NXP Semiconductors
NXP
-
-
-
87 Kb
2.
Datasheet MF1ICS2005U7DSawn bumped 120lm wafer addendum
NXP Semiconductors
NXP
-
-
-
87 Kb
3.
Datasheet MF1ICS2005W7DSawn bumped 120lm wafer addendum
NXP Semiconductors
NXP
-
-
-
87 Kb
4.
Datasheet MF1ICS50Functional specification Public transportation
NXP Semiconductors
NXP
-
-
-
153 Kb
5.
Datasheet MF1ICS5005V1DStandard Card IC Specification bumped sawn wafer on UV-tape
NXP Semiconductors
PHILIPS
-
-
-
38 Kb
6.
Datasheet MF1ICS5005W1DStandard Card IC Specification bumped sawn wafer on UV-tape
NXP Semiconductors
PHILIPS
-
-
-
38 Kb
7.
Datasheet MF1ICS50_10Functional specification Public transportation
NXP Semiconductors
NXP
-
-
-
153 Kb
8.
Datasheet MF1ICS70_10Functional specification Public transportation
NXP Semiconductors
NXP
-
-
-
156 Kb

 
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