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73771-1190 Datasheet

 Datasheet for
Description:2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits
Manufacturer:Molex Electronics Ltd.
Temp. range:Min: - | Max: -
Package:Not available...
Pins:Not available...
Link: 73771-1190.PDF (143 Kb)


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73771-1190.PDF

73771-1190 datasheet: 2.00mm (.079

Datasheet


RELEVANT RESULTS FOR 73771-1190 DATASHEET

#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
Datasheet 73771-11002.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Press-Fit
Molex Electronics Ltd.
MOLEX
-
-
-
222 Kb
2.
Datasheet 73771-11012.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits
Molex Electronics Ltd.
MOLEX
-
-
-
222 Kb
3.
Datasheet 73771-11902.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits
Molex Electronics Ltd.
MOLEX
-
-
-
143 Kb
4.
Datasheet 1737710000Cable glands
Weidmuller
WEIDMULLER
-
-
-
754 Kb
5.
Datasheet 07377111002.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Press-Fit
Molex Electronics Ltd.
MOLEX
-
-
-
222 Kb
6.
Datasheet 07377111012.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits
Molex Electronics Ltd.
MOLEX
-
-
-
222 Kb
7.
Datasheet 07377111902.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits
Molex Electronics Ltd.
MOLEX
-
-
-
143 Kb

 
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