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RELEVANT RESULTS FOR MR18R1624EG0-CT9 DATASHEET| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size | | 1. |  MR18R16224DF0 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 2. | MR18R16228DF0 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 3. | MR18R1622AF0-CK8 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 4. | MR18R1622AF0-CM8 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 5. | MR18R1622DF0 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 6. | MR18R1622GDF0 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 7. | MR18R16248EG0 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 8. | MR18R1624AF0-CK8 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 9. | MR18R1624AF0-CM8 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 10. | MR18R1624AF1-CN9 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 11. | MR18R1624AF1-CT9 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 12. | MR18R1624EG0-CK8 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 13. | MR18R1624EG0-CM8 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 14. | MR18R1624EG0-CT9 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 15. | MR18R1624GEG0 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb | | 16. | MR18R1628AF0-CK8 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 17. | MR18R1628AF0-CM8 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 18. | MR18R1628AF1-CN9 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 19. | MR18R1628AF1-CT9 | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Samsung semiconductor | SAMSUNG | - | - | - | 431 Kb | | 20. | MR18R1628EG0-CK8 | Key Timing Parameters | Samsung semiconductor | SAMSUNG | - | - | - | 454 Kb |
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