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0877970010 Datasheet

 Datasheet for
Description:2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
Manufacturer:Molex Electronics Ltd.
Temp. range:Min: - | Max: -
Package:Not available...
Pins:Not available...
Link: 0877970010.PDF (115 Kb)


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0877970010.PDF

0877970010 datasheet: 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging 0877970010

Datasheet


RELEVANT RESULTS FOR 0877970010 DATASHEET

#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
Datasheet 08779101142.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
Molex Electronics Ltd.
MOLEX
-
-
-
131 Kb
2.
Datasheet 08779101162.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
Molex Electronics Ltd.
MOLEX
-
-
-
131 Kb
3.
Datasheet 08779101202.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
Molex Electronics Ltd.
MOLEX
-
-
-
131 Kb
4.
Datasheet 08779211142.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
Molex Electronics Ltd.
MOLEX
-
-
-
477 Kb
5.
Datasheet 08779211162.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
Molex Electronics Ltd.
MOLEX
-
-
-
477 Kb
6.
Datasheet 08779211202.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
Molex Electronics Ltd.
MOLEX
-
-
-
477 Kb
7.
Datasheet 08779221162.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
Molex Electronics Ltd.
MOLEX
-
-
-
477 Kb
8.
Datasheet 08779221202.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
Molex Electronics Ltd.
MOLEX
-
-
-
477 Kb
9.
Datasheet 08779400012.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits
Molex Electronics Ltd.
MOLEX
-
-
-
95 Kb
10.
Datasheet 08779400022.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits
Molex Electronics Ltd.
MOLEX
-
-
-
103 Kb
11.
Datasheet 08779700102.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
Molex Electronics Ltd.
MOLEX
-
-
-
115 Kb
12.
Datasheet 08779700402.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54lm (100l) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
Molex Electronics Ltd.
MOLEX
-
-
-
186 Kb
13.
Datasheet 08779706022.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76lm (30l) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
Molex Electronics Ltd.
MOLEX
-
-
-
251 Kb
14.
Datasheet 08779712002.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76lm (30l) Gold (Au) Plating, 8.00mm (.315) Stacking Height
Molex Electronics Ltd.
MOLEX
-
-
-
251 Kb
15.
Datasheet 08779718002.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
Molex Electronics Ltd.
MOLEX
-
-
-
251 Kb

 
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