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RELEVANT RESULTS FOR 0353000250 DATASHEET# | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size | 1. | 05803530 | tyco electronics contents | Tyco Electronics | TYCO | - | - | - | 5.39 Mb | 2. | 06203530 | tyco electronics contents | Tyco Electronics | TYCO | - | - | - | 5.39 Mb | 3. | 0716603530 | 1.27mm (.050") Pitch EBBI 50D - Receptacle, Vertical, IDT | Molex Electronics Ltd. | MOLEX | - | - | - | 166 Kb | 4. | QK08A-2203530 | Crossflow Blower | ebm-papst | EBMPAPST | - | - | - | 304 Kb | 5. | QK08A-2/203530 | Crossflow Blower | ebm-papst | EBMPAPST | - | - | - | 304 Kb | 6. | 0303530000 | SAK-series | Weidmuller | WEIDMULLER | - | - | - | 1.87 Mb | 7. | 0353000250 | 2.50mm (.098") Pitch Wire-to-Board KK^ Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 2 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | MOLEX | - | - | - | 181 Kb | 8. | 0353000350 | 2.50mm (.098") Pitch Wire-to-Board KK^ Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 3 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | MOLEX | - | - | - | 181 Kb | 9. | 0353000450 | 2.50mm (.098") Pitch Wire-to-Board KK^ Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 4 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | MOLEX | - | - | - | 181 Kb | 10. | 0353000452 | 2.50mm (.098") Pitch Wire-to-Board KK^ Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 4 Circuits, Tin (Sn) Plating, Red | Molex Electronics Ltd. | MOLEX | - | - | - | 190 Kb | 11. | 0353000550 | 2.50mm (.098") Pitch Wire-to-Board KK^ Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 5 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | MOLEX | - | - | - | 181 Kb | 12. | 0353000650 | 2.50mm (.098") Pitch Wire-to-Board KK | Molex Electronics Ltd. | MOLEX | - | - | - | 181 Kb | 13. | 2CW035300JL | 2CW035XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE | Silan Microelectronics Joint-stock | SILAN | - | - | - | 32 Kb | 14. | 2CW035300JLR | 2CW035XXXJLR SERIES ZNER DIODE CHIPS FOR PLASTIC PACKAGE WITH ASYMMETRY LIMITS | Silan Microelectronics Joint-stock | SILAN | - | - | - | 28 Kb | 15. | 2CW035300YQ | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | SILAN | - | - | - | 56 Kb | 16. | 2CW035300YQ2 | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | SILAN | - | - | - | 56 Kb | 17. | 2CW035300YQ5 | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | SILAN | - | - | - | 56 Kb | 18. | 2CW035300YQPA | 2CW035XXXYQPX SERIES ZENER DIODE CHIPS FOR GLASS SEAL WITH ASYMMETRY LIMITS | Silan Microelectronics Joint-stock | SILAN | - | - | - | 43 Kb | 19. | 2CW035300YQPB | 2CW035XXXYQPX SERIES ZENER DIODE CHIPS FOR GLASS SEAL WITH ASYMMETRY LIMITS | Silan Microelectronics Joint-stock | SILAN | - | - | - | 43 Kb | 20. | 2CW035300YQPC | 2CW035XXXYQPX SERIES ZENER DIODE CHIPS FOR GLASS SEAL WITH ASYMMETRY LIMITS | Silan Microelectronics Joint-stock | SILAN | - | - | - | 43 Kb |
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