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# | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
1. | PSBH75 | Single Phase Half Controlled Bridges | Powersem GmbH | POWERSEM | - | - | - | 198 Kb |
2. | BH75331F | High Profile SIP Thick Film Conformal Coated Resistor Networks | Bi technologies | BITECH | - | - | - | 53 Kb |
3. | BH75331J | High Profile SIP Thick Film Conformal Coated Resistor Networks | Bi technologies | BITECH | - | - | - | 53 Kb |
4. | BH75471F | High Profile SIP Thick Film Conformal Coated Resistor Networks | Bi technologies | BITECH | - | - | - | 53 Kb |
5. | BH75471J | High Profile SIP Thick Film Conformal Coated Resistor Networks | Bi technologies | BITECH | - | - | - | 53 Kb |
6. | 1MBH75D-060 | Ratings and characteristics of Fuji IGBT | Fuji Electric | FUJI | - | - | - | 4.40 Mb |
7. | 1MBH75D-060S | 600V / 75A Molded Package | Fuji Electric | FUJI | - | - | - | 454 Kb |
8. | 1MBH75D-060S | Ratings and characteristics of Fuji IGBT | Fuji Electric | FUJI | - | - | - | 4.40 Mb |
9. | 1MBH75D-060S_04 | 600V / 75A Molded Package | Fuji Electric | FUJI | - | - | - | 454 Kb |
10. | QEV4BH75DT100 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
11. | QEV4BH75DT15 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
12. | QEV4BH75DT25 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
13. | QEV4BH75DT50 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
14. | QEV4BH75HQ100 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
15. | QEV4BH75HQ15 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
16. | QEV4BH75HQ25 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
17. | QEV4BH75HQ50 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
18. | W982516BH75I | 4M X 4 BANKS X 16 BIT SDRAM | Winbond | WINBOND | - | - | - | 1.17 Mb |
19. | QEV4BH75JQ100 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |
20. | QEV4BH75JQ15 | DIL 8 Pin Half Size VCXO - Communications Equipment Application | TEMEX | TEMEX | - | - | - | 286 Kb |