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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 41. |  UT22VP10E-20PPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 42. | UT22VP10E-20PPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 43. | UT22VP10E-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 44. | UT22VP10E-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 45. | UT22VP10E-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 46. | UT22VP10E-25PPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 47. | UT22VP10E-25PPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 48. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 49. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 50. | UT22VP10E-25UPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 51. | UT22VP10E-25UPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
