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ChipManuals is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 32      Displaying: 11 - 20
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
11.
Datasheet ACS101AOptical modem IC
SEMTE
PLCC
44
-40°C
85°C
122K
12.
Datasheet ACS102A-PLFiber modem
SEMTE
PLCC
44
-40°C
85°C
147K
13.
Datasheet ACS102A-TQFiber modem
SEMTE
TQFP
44
-40°C
85°C
147K
14.
Datasheet UT54ACS10Radiation-hardened quadruple 3-input NAND gate.
UTMC
DIP
14
-55°C
125°C
32K
15.
Datasheet UT54ACS10Radiation-hardened quadruple 3-input NAND gate.
UTMC
FlatPack
14
-55°C
125°C
32K
16.
Datasheet UT54ACS109Radiation-hardened dual J-K flip-flop.
UTMC
DIP
16
-55°C
125°C
52K
17.
Datasheet UT54ACS109Radiation-hardened dual J-K flip-flop.
UTMC
FlatPack
16
-55°C
125°C
52K
18.
Datasheet UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
19.
Datasheet UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
20.
Datasheet UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
21.
Datasheet UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
1 2 3 4

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