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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. |  NX8564LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | CEL | - | - | - | 448 Kb |
| 2. | NX8565LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | CEL | - | - | - | 448 Kb |
| 3. | NX8566LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | CEL | - | - | - | 448 Kb |
| 4. | NX8564LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | CEL | - | - | - | 448 Kb |
| 5. | NX8565LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | CEL | - | - | - | 448 Kb |
| 6. | NX8566LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | CEL | - | - | - | 448 Kb |
| 7. | TLE8201R | Door Module Power IC | Infineon Technologies AG | INFINEON | - | - | - | 375 Kb |
| 8. | TLE8203E | Mirror Power IC | Infineon Technologies AG | INFINEON | - | - | - | 444 Kb |
| 9. | TLE8209-2SA | SPI Programmable H-Bridge | Infineon Technologies AG | INFINEON | - | - | - | 469 Kb |
| 10. | TLE8242-2 | 8 Channel Fixed Frequency Constant Current Control With Current Profile Detection | Infineon Technologies AG | INFINEON | - | - | - | 688 Kb |
| 11. | TLE8250G | High Speed CAN-Transceiver | Infineon Technologies AG | INFINEON | - | - | - | 1.28 Mb |
| 12. | TLE8250GVIO | High Speed CAN-Transceiver | Infineon Technologies AG | INFINEON | - | - | - | 1.30 Mb |
| 13. | TLE8261-2E | Universal System Basis Chip | Infineon Technologies AG | INFINEON | - | - | - | 1.00 Mb |
| 14. | TLE8261E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | INFINEON | - | - | - | 1014 Kb |
| 15. | TLE8262-2E | Universal System Basis Chip | Infineon Technologies AG | INFINEON | - | - | - | 1.10 Mb |
| 16. | TLE8262E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | INFINEON | - | - | - | 1.09 Mb |
| 17. | TLE8263-2E | Universal System Basis Chip | Infineon Technologies AG | INFINEON | - | - | - | 1.11 Mb |
| 18. | TLE8263E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | INFINEON | - | - | - | 1.09 Mb |
| 19. | TLE8264-2E | Universal System Basis Chip | Infineon Technologies AG | INFINEON | - | - | - | 1.12 Mb |
| 20. | TLE8264E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | INFINEON | - | - | - | 1.17 Mb |
