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Searchign results: 40670

40670 datasheet

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We have more Special DataSheet than other site. If, There is not a datasheet which searches, Request ! (It will updated in 12 hours.)
ChipManuals is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 0 - 19

#	Part:	Description:	Manuf.	Package	Pins	T°min	T°max	PDF size
1.	5024940670	2.00mm (.079") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Right Angle, 6 Circuits	Molex Electronics Ltd.	MOLEX	-	-	-	263 Kb
2.	5025840670	1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Vertical, 6 Circuits	Molex Electronics Ltd.	MOLEX	-	-	-	593 Kb
3.	0532540670	2.00mm (.079") Pitch Micro-Latch Wire-to-Board Header, Right Angle, Square Pin,Three-sided Shroud, Lead-free, 6 Circuits	Molex Electronics Ltd.	MOLEX	-	-	-	136 Kb
4.	0554540670	1.25mm (.049") Pitch Mi ll System Wire-to-Board Header, Single Row, Right AngleLead-free, 6 Circuits	Molex Electronics Ltd.	MOLEX	-	-	-	143 Kb
5.	84067012A	CMOS Octal Latching Bus Driver	Intersil Corporation	INTERSIL	-	-	-	110 Kb
6.	84067012A	CMOS Octal Latching Bus Driver	Intersil Corporation	INTERSIL	-	-	-	118 Kb
7.	8406701RA	CMOS Octal Latching Bus Driver	Intersil Corporation	INTERSIL	-	-	-	110 Kb
8.	8406701RA	CMOS Octal Latching Bus Driver	Intersil Corporation	INTERSIL	-	-	-	118 Kb
9.	0440670201	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
10.	84067022A	CMOS Octal Latching Inverting Bus Driver	Intersil Corporation	INTERSIL	-	-	-	112 Kb
11.	8406702RA	CMOS Octal Latching Inverting Bus Driver	Intersil Corporation	INTERSIL	-	-	-	112 Kb
12.	0440670401	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
13.	0440670402	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
14.	0440670403	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76lm (30l") Gold (Au) Selective Plating	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
15.	0440670601	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
16.	0440670602	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
17.	0440670603	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
18.	0440670801	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb
19.	0440670802	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick	Molex Electronics Ltd.	MOLEX	-	-	-	205 Kb

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