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Found: 57      Displaying: 51 - 57
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Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
51.
Datasheet UT54ACS109PCARadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
16
-55°C
125°C
15K
52.
Datasheet UT54ACS109PCCRadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
16
-55°C
125°C
15K
53.
Datasheet UT54ACS109PCXRadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
16
-55°C
125°C
15K
54.
Datasheet UT54ACS109UCARadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
16
-55°C
125°C
15K
55.
Datasheet UT54ACS109UCCRadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
16
-55°C
125°C
15K
56.
Datasheet UT54ACS109UCXRadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
16
-55°C
125°C
15K
57.
Datasheet UT54ACS10PCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
1 2 3 4 5 6

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