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8974N datasheet
Why ChipManuals.com ?
We have more Special DataSheet than other site. If, There is not a datasheet which searches, Request ! (It will updated in 12 hours.)
ChipManuals is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.
Found: 0 - 21| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size | | 1. |  8974 | RF Amplifier | Communications & Power Industries, Inc. | CPI | - | - | - | 76 Kb | | 2. | 8974 | RF Amplifier | Communications & Power Industries, Inc. | CPI | - | - | - | 76 Kb | | 3. | 028974 | A solid moulded core with soft outer grip, less force, yet achieves 40% more torque | List of Unclassifed Manufacturers | ETC | - | - | - | 550 Kb | | 4. | WM8974 | MONO CODEC WITH SPEAKER DRIVER | Wolfson Microelectronics plc | WOLFSON | - | - | - | 832 Kb | | 5. | 0010897400 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 6. | 5962-8974001RA | High-Speed CMOS Logic Octal Three-State Bus Transceiver, Inverting | Texas Instruments | TI | - | - | - | 269 Kb | | 7. | 5962-8974001RA | High-Speed CMOS Logic Octal Three-State Bus Transceiver, Inverting | Texas Instruments | TI | - | - | - | 275 Kb | | 8. | 0010897401 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 9. | 0010897402 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.38lm (15l") Gold (Au) Selective Plating | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 10. | 223897411447 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | PHILIPS | - | - | - | 86 Kb | | 11. | 223897411461 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | PHILIPS | - | - | - | 86 Kb | | 12. | 223897411547 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | PHILIPS | - | - | - | 86 Kb | | 13. | 223897411561 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | PHILIPS | - | - | - | 86 Kb | | 14. | 0010897420 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, 0.76lm (30l") Gold (Au) Selective Plating | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 15. | 0010897421 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 16. | 0010897422 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, HighTemperature, 42 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC TailPlating | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 17. | 5962-8974301EA | High-Speed CMOS Logic Hex D-Type Flip-Flop with Reset | Texas Instruments | TI | - | - | - | 280 Kb | | 18. | 0010897440 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 19. | 0010897441 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 20. | 0010897442 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row | Molex Electronics Ltd. | MOLEX | - | - | - | 424 Kb | | 21. | 223897451447 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | PHILIPS | - | - | - | 86 Kb |
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