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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. |  KA2263 | LINEAR INTEGRATED CIRCUIT | Samsung semiconductor | SAMSUNG | - | - | - | 224 Kb |
| 2. | BB-2263 | InsulKrimp Fully Insulated Coupler, Female, for 14-16 AWG Wire, Box | Molex Electronics Ltd. | MOLEX | - | - | - | 99 Kb |
| 3. | 2SC2263 | SI NPN EPITAXIAL PLANAR | Panasonic Semiconductor | PANASONIC | - | - | - | 211 Kb |
| 4. | 2SD2263 | Silicon NPN Epitaxial | Hitachi Semiconductor | HITACHI | - | - | - | 35 Kb |
| 5. | 2SD2263 | Silicon NPN Epitaxial | Renesas Technology Corp | RENESAS | - | - | - | 158 Kb |
| 6. | AMS2263 | Extended Burst Mode Control For Improved | Advanced Monolithic Systems Ltd | AMS | - | - | - | 506 Kb |
| 7. | L-12263 | Power Line Chokes | Rhombus Industries Inc. | RHOMBUSIND | - | - | - | 17 Kb |
| 8. | HB02263 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | ETC | - | - | - | 154 Kb |
| 9. | HB12263 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | ETC | - | - | - | 154 Kb |
| 10. | HC02263 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | ETC | - | - | - | 154 Kb |
| 11. | NJM2263 | 3-INPUT VIDEO SUPER IMPOSER WITH 75OHM DRIVER | New Japan Radio | NJRC | - | - | - | 204 Kb |
| 12. | T-12263 | Wideband RF Impedance Matching Transformers | Rhombus Industries Inc. | RHOMBUSIND | - | - | - | 48 Kb |
| 13. | HC12263 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | ETC | - | - | - | 154 Kb |
| 14. | RMPA2263 | WCDMA Power Amplifier Module 1920-1980 MHz | Fairchild Semiconductor | FAIRCHILD | - | - | - | 114 Kb |
| 15. | SGA-2263 | DC-5000MHZ CASCADABLE SIGE HBT MMIC AMPLIFIER | Stanford Microdevices | STANFORD | - | - | - | 389 Kb |
| 16. | SGA-2263 | DC-5000 MHz, Cascadable SiGe HBT MMIC Amplifier | SIRENZA MICRODEVICES | SIRENZA | - | - | - | 252 Kb |
| 17. | TPS62263 | 2.25 MHz 600 mA Step Down Converter in 2x2SON/TSOT-23 Package | Texas Instruments | TI | - | - | - | 1.30 Mb |
| 18. | 0010112263 | 2.54mm (.100") Pitch KK^ Crimp Terminal Housing, High Pressure, 26 Circuits | Molex Electronics Ltd. | MOLEX | - | - | - | 209 Kb |
| 19. | 73780-2263 | 2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 4.00mm (.157"), | Molex Electronics Ltd. | MOLEX | - | - | - | 196 Kb |
| 20. | 10-11-2263 | 2.54mm (.100") Pitch KK^ Crimp Terminal Housing, High Pressure, 26 Circuits | Molex Electronics Ltd. | MOLEX | - | - | - | 209 Kb |
