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KT8557BN Datasheet

 Datasheet for Samsung Electronic
Description:1 chip CODEC
Manufacturer:Samsung Electronic
Temp. range:Min: -25°C | Max: 70°C
Package:DIP-300A
Pins:16
Link: KT8557BN.PDF (152Kb)


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KT8557BN.PDF

KT8557BN datasheet: 1 chip CODEC KT8557BN

Datasheet


RELEVANT RESULTS FOR KT8557BN DATASHEET

#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
Datasheet M58LR256KT855128 or 256 Mbit (‡16, multiple bank, multilevel interface, burst) 1.8 V supply Flash memories
Numonyx B.V
NUMONYX
-
-
-
1.85 Mb
2.
Datasheet M58LR128KT855128 or 256 Mbit (‡16, multiple bank, multilevel interface, burst) 1.8 V supply Flash memories
Numonyx B.V
NUMONYX
-
-
-
1.85 Mb
3.
Datasheet KT85541 CHIP CODECS
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
4.
Datasheet KT8554B1 CHIP CODECS
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
5.
Datasheet KT8554BD1 chip CODEC
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
6.
Datasheet KT8554BJ1 chip CODEC
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
7.
Datasheet KT8554BN1 chip CODEC
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
8.
Datasheet KT8555TIME SLOT ASSIGNMENT CIRCUIT
Samsung semiconductor
SAMSUNG
-
-
-
78 Kb
9.
Datasheet KT8555JTIME SLOT ASSIGNMENT CIRCUIT
Samsung semiconductor
SAMSUNG
-
-
-
78 Kb
10.
Datasheet KT8557B1 CHIP CODECS
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
11.
Datasheet KT8557BD1 chip CODEC
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
12.
Datasheet KT8557BJ1 chip CODEC
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb
13.
Datasheet KT8557BN1 chip CODEC
Samsung semiconductor
SAMSUNG
-
-
-
124 Kb

 
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